From March 26 to 28, SEMICON China 2026 was held at the Shanghai New International Expo Centre. As an emerging force in precision machining, Siplus Semiconductor made its first appearance and attracted many professional visitors, maintaining strong booth traffic throughout the exhibition. Leveraging its self-developed integrated slicing, grinding, and polishing solution and full-size processing capability covering 6, 8, and 12 inches, Siplus reached preliminary cooperation intentions with multiple domestic and international leading substrate manufacturers, advanced packaging companies, and research institutions during the exhibition.
On-Site Highlights: Technical Expertise Drives In-Depth Customer Discussions
During the exhibition, Siplus Semiconductor highlighted its precision machining equipment and automated production line solutions covering the entire "slicing, grinding, polishing" process. The extreme flatness specifications – TTV ≤1μm for silicon carbide semi-insulating substrates and TTV 1–1.5μm for conductive substrates – became a focal point for technical customers. Many professional visitors engaged with engineers around equipment models and samples, discussing in detail how such precision is achieved.
What greatly encouraged the team was that on the very first day, several leading domestic and international substrate manufacturers made special trips to engage with Siplus. Many of these companies had already learned about Siplus's integrated slicing-grinding-polishing solution through industry channels before the exhibition. They were impressed by Siplus's technical expertise in core equipment such as grinding, polishing, and CMP, and seized this opportunity to conduct in-depth discussions on potential mass production cooperation.
In the field of advanced packaging, Siplus's capabilities in supporting various advanced packaging structures, enabling high-density interconnection technologies, and achieving nanometer-level global planarization attracted technical leaders from several packaging companies. An engineer from a leading domestic packaging house commented on-site: "We are currently developing backside power delivery technology, which requires extremely high uniformity and flatness in wafer grinding. Siplus's technical capabilities in this area exactly meet our needs."
Product Showcase: Complete Capabilities from Single Machines to Full Lines
The fully automated production line was another highlight of the booth. Siplus showcased a fully automated production line for silicon carbide substrate laser slicing and grinding, integrating units such as ingot grinding, laser modification, ultrasonic lift-off, and AGV transport to form a closed-loop process from "ingot in to substrate out." Compared to discrete operations, this line improves overall efficiency by more than 30% and completely eliminates the risk of chipping and contamination caused by manual handling. Several customers planning 8-inch silicon carbide mass production lines showed strong interest and had in-depth discussions with engineers on line layout, takt time, and other aspects.
Service Capabilities: Pilot Line + Process Team Attract R&D Customers
During the exhibition, Siplus's dedicated pilot line for precision machining of semiconductor materials became a key focus for R&D customers. The pilot line is equipped with full-process process verification capability for 6, 8, and 12 inches. Led by a senior process team, it focuses on tackling challenging issues such as ultra-low flatness for silicon carbide, ultra-thin grinding for silicon interposers, and TGV planarization for glass substrates.
Several customers from universities and research institutions expressed on-site their desire to send samples of new materials to Siplus's pilot line for process verification. A professor engaged in the study of gallium oxide single crystals said after communicating with the team: "Post-processing has always been a bottleneck to our industrialization. The fact that you are willing to undertake process development for such frontier materials makes you exactly the partner we urgently need."
Cooperation Outcomes: Preliminary Intentions Reached with Multiple Leading Companies
During the exhibition, Siplus Semiconductor reached preliminary cooperation intentions with multiple leading domestic and international companies across several directions. A representative of Siplus said: "This debut at SEMICON has made us deeply feel the market's trust and expectations for domestic precision machining equipment. Whether it is mass production of large-size substrates or frontier exploration of fourth-generation materials, customers have very clear requirements for precision, stability, and service response speed. Our positioning of 'equipment + process + full line' is highly aligned with industry pain points."
He further emphasized: "Our goal is not to be a single-equipment supplier, but to become a 'technology partner' for precision machining in the multi-material era. Whether it is silicon or compound semiconductors: gallium arsenide, indium phosphide, silicon carbide – whether it is substrate processing or advanced packaging – as long as customers have needs, Siplus can provide complete solutions from equipment and processes to production line integration."
At this grand event gathering the attention of the global semiconductor industry, Siplus Semiconductor delivered a solid performance with precision machining as its fulcrum. From ultra-precision planarization technical indicators to efficiency improvements of more than 30%, from silicon to compound semiconductors, from substrates to advanced packaging – Siplus is winning recognition from more and more industry partners with its strong technical capabilities and open cooperation attitude.