Siplus Semiconductor inherits the technical heritage and craftsmanship cultivated by the Morimatsu Group since 1947. Anchored in the global semiconductor industry and backed by a team of seasoned Japanese semiconductor advisors and robust R&D capabilities, we collaborate with leading institutions worldwide – including Tokyo University of Agriculture and Technology, Tohoku University, and East China University of Science and Technology. This synergy fosters a deeply integrated industry-academia-research ecosystem, enabling us to develop cutting-edge semiconductor equipment and processes. We deliver comprehensive "one-stop" wafer processing solutions for cutting, grinding, and polishing.

Rooted in Silicon, Building the Future.Guided by our mission to " Precision in Every Wafer, Excellent in Every Chip," Siplus Semiconductor pioneers next-generation semiconductor wafer processing technologies. Our vision is to become the indispensable global leader in ultra-precision wafer surface processing technology and services. We maintain localized 24/7 service networks to ensure rapid delivery and efficient operational support, safeguarding customer interests. By precisely addressing demands across semiconductors, new energy vehicles, photovoltaics, and 5G communications, we propel advanced wafer processing technology toward new frontiers of excellence.