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The Industry Leader in Ultra-Precision Wafer Surface Processing Technology and Services
Products
Suitable for processing materials including: SiC, Si, Ge, GaAs
Laser Slicing
Laser slicing machine series
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Thinning
Thinning machine series
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Single-Side Polishing
Single-side polishing machine series
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Double-Side Polishing
Double-side polishing machine series
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CMP
CMP series
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Consumables & Components
Full range of consumable products
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Industry Applications
New Energy Vehicles (NEV)
Photovoltaics (PV)
Industrial Automation
Rail Transportation
5G Communications
Radar Systems
AR Glasses
Consumer Electronics
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June 11,2025
Morimatsu International and TÜV SÜD Sign Strategic Cooperation Agreeme...
March 27,2025
Rising Against the Odds, and Staying True to Our Roots —A Picture to Understand ...
December 31,2024
Footprints of Morimatsu People in 2024 - A Reflection on Our Extraordinary Journ...
About Siplus
Siplus Semiconductor inherits the technical heritage and craftsmanship cultivated by the Morimatsu Group since 1947. Anchored......
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