Core Technological Innovations
Addressing SiC material challenges – extreme hardness, brittleness, and difficult machinability – we deliver revolutionary breakthroughs in thinning, polishing, and CMP processes through proprietary technologies. Our solutions provide semiconductor manufacturing with unmatched precision, efficiency, and stability.
Thinning Process: Dual Leap in Efficiency & Precision
High-Power Rigid Air Spindle System
Industry-leading rigid support structure enables high-speed stable processing, dramatically improving material removal efficiency.
Ultra-Precision Grinding Stage
Nanometer-level flatness control ensures global wafer planarity, laying the foundation for subsequent processes.
Adaptive Thickness Control System
Real-time dynamic compensation technology overcomes industry challenges in SiC thickness uniformity.
Single-Side Polishing: Pressure Control & Structural Innovation
Ultra-High-Pressure Polishing Platform
Breakthrough high-load design significantly boosts material removal rate and throughput.
Low-Center-of-Gravity Anti-Vibration Structure
Patented mechanical architecture enables long-term high-stability operation.
Tri-Zone Smart Pressure System
Independent zone pressure control optimizes profile accuracy from edge to center, improving yield.
Temperature-Pressure Synergy Module
Precision-coordinated control eliminates thermal deformation for ultra-precise polishing.
Double-Side Polishing: Nanoscale Flatness & Zero-Defect Control
Dynamic Platen Stabilization Technology
Real-time deformation compensation achieves nanometer-level global flatness.
High-Rigidity Multi-Stage Buffer Structure
Innovative mainframe design enhances impact resistance and extends equipment lifespan.
Intelligent Breakage Warning System
AI-powered multi-sensor fusion predicts fracture risks, virtually eliminating scrap wafers.
CMP Process: Nanoscale Planarity & Zero-Defect Control
Head Inner/Outer Ring Pressure Decoupling
Independent pressure control (Patented) enables uniform polishing across entire wafer surface.
High-Rigidity Platen Architecture
Reinforced pressure-bearing design meets demanding polishing requirements for 3rd-gen semiconductors.