From August 31 to September 2, the 14th Semiconductor Equipment, Materials and Core Components Exhibition (CSEAC 2026) was held at the Wuxi Taihu International Expo Center. As one of the highest‑profile events in China’s semiconductor equipment sector, this year’s CSEAC brought together more than 1,400 domestic and overseas companies, with an exhibition area exceeding 70,000 square metres.

Siplus Semiconductor made its debut at CSEAC with a full‑process slicing, grinding, and polishing solution, demonstrating its complete processing capability from ingot to substrate. The offering covers core processes such as 6–12‑inch wafer slicing, single‑side / double‑side polishing, and CMP planarisation. During the show, the Siplus booth attracted sustained interest from substrate manufacturers, advanced packaging houses, and research institutes.

At the “Equipment and Core Component Innovation Competition” held concurrently with CSEAC 2026, Siplus Semiconductor stood out among numerous competing products and won the Equipment Innovation Award with its self‑developed double‑side polisher.

This award recognises the industry’s acknowledgement of Siplus’s technical strength and engineering capabilities in the field of grinding, lapping and polishing. Siplus will continue to focus on core precision‑processing technologies, providing more reliable equipment support for semiconductor substrate manufacturing and advanced packaging.