Today, as the global semiconductor industry strives for high performance and supply chain autonomy and controllability, we are proud to announce a milestone achievement: Shanghai Siplus Semiconductor Co., Ltd.’s self-developed large-size double-side polishing machine has completed its first shipment, successfully been introduced into a global leading semiconductor materials enterprise, and passed its stringent production line verification and acceptance. 

This is not only a major breakthrough for our double-side polishing machine product, but also a landmark achievement for domestic high-end precision processing equipment in gaining the trust of a global leading customer for large-scale mass production at core process stages, strongly validating our technological strength and market competitiveness.

A Successful First Battle, Joining the Global Top-Tier Supply Chain

This delivery is of extraordinary significance, marking the "first deployment" of Siplus's double-side polishing machine product. We are delighted to see that the very first unit successfully entered the mass production system of a global leading customer. This fully verifies the end-to-end maturity and reliability of Siplus products, from design and manufacturing to debugging, and demonstrates our capability to directly meet the most stringent standards of world-class customers.

Deep Integration of Precision Equipment and Advanced Process Technology

The key to our equipment achieving top-tier performance lies in the deep integration of precision machinery and advanced process solutions. Thanks to innovative system design and mature process solutions, the equipment can achieve and stably maintain the following core metrics:

Semi-insulating substrates: Can achieve extreme flatness with TTV ≤ 1μm, laying the foundation for high-end applications such as 5G RF and optical waveguides.
Conductive substrates: Can stably control TTV within the excellent range of 1-1.5μm, fully meeting the stringent requirements for consistency in fields like new energy vehicles and industrial control.

This outstanding data performance is precisely the result of the synergistic empowerment of our equipment hardware and exclusive process knowledge, providing reliable assurance for customers to mass-produce high-quality substrates.

Enabling 8-inch Mass Production, Compatible with 12-inch Upgrade

This collaboration directly addresses the customer's core mass production needs. The first unit is fully adapted to the mass production pace of 8-inch silicon carbide substrates, enabling stable and efficient enhancement of the customer's existing capacity. More importantly, our forward-looking design deserves emphasis. This equipment platform possesses strong technical extensibility and can "smoothly compatibilize" future processes for 12-inch large-size substrates. This means that the customer's investment today is also a key layout to gain a head start in tomorrow's technological upgrade.

Practicing Domestic Substitution, Empowering Industrial Chain Autonomy

The successful shipment and customer introduction of our first double-side polishing machine powerfully proves that domestic high-end equipment can not only achieve technological breakthroughs but also complete comprehensive verification from R&D to reliable delivery. Looking ahead, Siplus Semiconductor will continue to focus on "precision manufacturing," deepen innovation, closely collaborate with global customers and partners, provide more competitive equipment solutions, contribute to industrial upgrading, and jointly shape a new, more efficient and autonomous semiconductor industry landscape.