The laser slicing equipment is an advanced laser-based system designed to segment SiC ingots into substrate wafers. It is suitable for processing 6-to-12-inch SiC products. Leveraging high-performance lasers and precision optical systems, the equipment significantly reduces the modified layer thickness during cutting, effectively minimizing potential impacts on the subsequent performance of the wafers. Compared to traditional wire cutting processes, this technology markedly enhances processing efficiency and increases production capacity. Furthermore, it can be integrated with thinning equipment to form an automated production line for combined laser slicing and thinning.