12-Inch Single-Spindle Thinning Equipment

The equipment adopts semi-automatic processing with manual loading and is applicable to various semiconductor hard and brittle materials including Si, SiC, GaN, sapphire, and ceramics. It processes products ranging from 2 to 12 inches with support for custom non-standard sizes, offering wide applicability and high compatibility. Featuring a compact structure, simple operation, and comprehensive functionality, the system incorporates a closed-loop thickness control system, making it suitable for various application scenarios such as universities, research institutes, and small-batch sample processing.

8" Dual-Spindle Wafer Thinning Machine

This system employs a dual-spindle three-table design equipped with automatic transfer, centering and edge-finding, cleaning and spin-drying, and closed-loop thickness control functions. It enables fully automated processing of various 4-8 inch wafers including Si/SiC/GaAs/Ge wafers. Specifically for third-generation semiconductor ultra-hard materials like SiC, the equipment provides unique thinning solutions utilizing high-power, high-rigidity, low-vibration air spindles combined with innovative grinding technology, low-stress processes, and high-precision control systems to achieve efficient and low-damage thinning of SiC materials.

8" Dual-Spindle Ingot Thinning Machine

Designed specifically for thinning ultra-hard material crystals such as SiC, this premium equipment features a dual-spindle three-table configuration with specially designed automation components and thickness measurement modules, enabling fully automated processing of 4-8 inch ultra-thick crystals.

12" Dual-Spindle Thinning Machine

The system incorporates a dual-spindle three-table design with functions including automatic transfer, centering and edge-finding, cleaning and spin-drying, and closed-loop thickness control. It supports fully automated processing of various 6-12 inch wafers including Si/SiC/GaAs/Ge wafers. For third-generation semiconductor ultra-hard materials like SiC, the equipment offers specialized thinning solutions using high-power, high-rigidity, low-vibration air spindles in combination with innovative grinding technology, low-stress processes, and high-precision control systems to accomplish efficient and low-damage thinning of SiC materials.

12" Triple-Spindle Thinning Machine

Featuring a triple-spindle four-table design, the equipment includes automatic transfer, centering and edge-finding, cleaning and spin-drying, and closed-loop thickness control capabilities. It enables fully automated processing of various 6-12 inch wafers including Si/SiC/GaAs/Ge wafers. Particularly for third-generation semiconductor ultra-hard materials like SiC, the system provides unique thinning solutions employing high-power, high-rigidity, low-vibration air spindles integrated with innovative grinding technology, low-stress processes, and high-precision control systems to realize efficient and low-damage thinning of SiC materials.