The equipment is suitable for double-side polishing of various hard and brittle semiconductor materials, including Si, SiC, GaN, GaAs, Ge, and sapphire. It processes 4-inch to 8-inch wafer substrate products. It features a high-rigidity, low-vibration main structure, integrates a stable and reliable PID air path control system, a PLC electrical control system, real-time fragment detection, and platen shape control functions, ensuring high precision and reliability in wafer material processing.