We are thrilled to announce a major milestone from the frontlines! Siplus Semiconductor’s self-developed high-precision wafer thinning system has successfully passed the rigorous, months-long validation process of a global top-tier silicon carbide (SiC) substrate manufacturer and is now officially integrated into their advanced production line.

This is far more than a successful equipment adoption—it represents a top-tier endorsement of Siplus Semiconductor’s technical excellence and product reliability from an industry leader.

Validated to Japanese Precision Standards,passed the "Most Stringent" Qualification Tests

Known for its exceptionally stringent supplier evaluation criteria, the customer assessed the system across all critical dimensions—equipment stability, process consistency, long-term reliability, and serviceability—making their validation process a true “gold standard” in the industry. Over several months of multi-round testing,  Siplus’s thinning system demonstrated outstanding performance:

Stable & Reliable: Achieved fault-free operation under continuous high-load conditions, significantly exceeding expected uptime.

Exceptional Precision: Delivered consistent thickness uniformity that meets the customer’s most demanding specifications.

Low-Damage Processing: Proprietary technology effectively minimized subsurface damage, directly contributing to higher wafer yield.

Intelligent Operation: User-centric design greatly enhanced production efficiency and maintenance convenience.

Localized Smart Manufacturing,Driving Greater Customer Value

 Siplus Semiconductor combines the legacy of Japanese precision engineering with deep localization in manufacturing and service. Leveraging a robust domestic supply chain, we deliver world-class quality while significantly improving cost efficiency and delivery responsiveness.

This successful collaboration validates Siplus’s core strengths: technology leadership, product reliability, and rapid on-site support. From initial technical consultation to post-installation process optimization, our engineering team provided seamless, high-efficiency support to ensure stable, high-performance production.

We look forward to building on this foundation to co-create the future of SiC manufacturing—together with our customers, toward mutual success.