With the rapid development of strategic emerging industries such as new energy vehicles, photovoltaic power generation, and AI computing power, third-generation semiconductor material silicon carbide is facing increasingly demanding precision processing challenges.
As an industry technology leader, Siplus Semiconductor, with years of deep expertise, has officially launched a fully automated production line for silicon carbide substrate laser slicing and grinding. Through deep collaboration with back-end polishing processes, the company now provides complete process support for substrate processing.
Breakthrough: From "Single-Machine Operation" to "Chain Automation"
Silicon carbide's high hardness and brittleness present significant challenges for traditional wire-cutting processing methods, which suffer from high material loss, frequent wire breakage, and deep surface damage—constraints that limit the yield and mass production of large-diameter substrates. To fundamentally improve processing quality, Siplus has introduced an automated production line for laser slicing and grinding, encompassing crystal ingot thinning machines, laser modification equipment, ultrasonic stripping equipment, and AGV handling systems. This line seamlessly integrates with subsequent grinding and polishing production lines, forming a complete closed-loop process from "ingot-in to substrate-out."
Laser technology, as a new-generation processing method for hard and brittle materials, achieves "pre-separation" of materials by precisely controlling laser scanning to create modification layers within crystal ingots, fundamentally reducing cutting stress and surface damage. Combined with precise ultrasonic stripping, this technology significantly improves internal stress distribution in wafers, enhancing substrate reliability and providing a clear technical pathway for 8-inch and future larger-diameter silicon carbide substrate manufacturing.
The entire production line employs AGVs and automated control systems to enable autonomous transfer and precise positioning of wafers between different modules. This not only drastically reduces manual intervention and operational risks but also ensures process consistency and product yield through standardized workflows, actively responding to national policies promoting smart manufacturing and industrial automation upgrades.
Capability: Full-Chain Automation Integration, Achieving Dual Improvements in Efficiency and Yield
Siplus Semiconductor's laser slicing and grinding automated production line achieves significant breakthroughs in overall line efficiency through deep collaboration and intelligent scheduling of all modules:
High-Performance Laser Unit Support
The laser machine, as the core processing unit of the production line, offers efficient processing capability with single-wafer processing time of 20–25 minutes (8-inch).
Material loss in the laser process segment is controlled to 80–100μm, preserving more processing margin for subsequent operations.
This unit achieves a processing yield of over 99.5%, establishing a solid foundation for high overall line yield.
Chain Automation Mass Production Capability
Significantly improved production efficiency: Chain automation eliminates cumbersome material handling and positioning between traditional processes, boosting comprehensive production efficiency by over 30% and substantially reducing manual intervention costs.
Ensured process stability: Intelligent control systems uniformly schedule process parameters across all modules, guaranteeing processing stability throughout the entire journey from laser modification to ultrasonic stripping. Substrates produced by the entire line exhibit excellent consistency and reliability.
Leading Advantage in Large-Diameter Substrate Processing
Mature 8-inch substrate automated processing: The production line currently possesses mature fully automated processing capabilities for 8-inch silicon carbide substrates, achieving industry-leading levels in processing yield and cost control.
Technical preparation and validation for 12-inch substrates: The line design incorporates technological foresight and already possesses validation capabilities for 12-inch processes, providing a solid technical foundation for future industry upgrades.
Open Empowerment: Driving Industry Chain Collaborative Innovation
Siplus Semiconductor adopts an open philosophy to build an industry empowerment platform, promoting collaborative development and technological advancement across the industry chain:
Providing comprehensive training and technical support to help customers rapidly build capabilities for automated production line operation and maintenance
Opening process validation platforms to the industry, supporting testing and iteration of new materials and processes in real production line environments
Exporting mature smart manufacturing systems and standards, offering replicable and sustainable upgrade paths for China's semiconductor industry
Mission: Empowering High-Quality Industry Development
As the global silicon carbide market continues rapid growth, manufacturing capabilities for large-diameter, low-cost, and high-efficiency substrates have become key competitive factors. Siplus Semiconductor's newly launched laser slicing and grinding automated production line not only effectively solves the high-loss, low-efficiency, and consistency challenges of traditional processing models but also provides the industry with stable, reliable substrate processing solutions through verifiable overall line performance improvements. This significantly enhances domestic industry chain's independent supporting capabilities and overall competitiveness.