At the "2025 Aurora Award" ceremony held in Shenzhen in December 2025, Siplus Semiconductor was honored with the "Annual Outstanding Product Award for Third-Generation Semiconductor Equipment" for its grinding equipment designed to achieve ultra-low flatness specifications. This accolade stands as a testament to our commitment to co-creating value with customers and driving industry breakthroughs through equipment innovation.
Overcoming Common Challenges:From Material Potential to Mass Production Capability
As the silicon carbide industry advances toward high-end optical and advanced power devices, a universal challenge faces the entire sector: how to stably and economically transform the exceptional performance of materials into high-quality, mass-producible substrates. In particular, achieving ultra-high global flatness (TTV) across wafers has become a critical bottleneck affecting downstream lithography precision and device performance.
Siplus Semiconductor has consistently focused on real pain points in customer production lines. The award-winning fully automatic thinning equipment and its underlying process solution represent a core breakthrough through our innovative ultra-low flatness adjustment technology—a comprehensive surface profile control process integrating grinding and double-side polishing. Our goal is to provide customers with a replicable, systematic solution to bridge the gap from "laboratory samples" to "mass-produced qualified products," achieving a leapfrog improvement in substrate flatness.
Empowering Industry Results:Laying the Manufacturing Foundation for Customers
The value of technology is ultimately demonstrated through customer success. Our mission is to empower customers to achieve decisive progress in their specialized fields:
In AR Optics:
Through close collaboration with leading substrate manufacturers, we enabled the stable mass production of 8-inch silicon carbide optical substrates for optical waveguides, consistently controlling TTV to within 1 micron—an internationally advanced standard. This has provided customers with valuable production capacity and quality credentials to enter the next-generation consumer electronics market.
In Power Electronics:
Our process solutions have helped multiple renowned substrate manufacturers achieve industry-leading TTV performance of less than 1.5 microns after grinding for their 6/8-inch conductive substrates. This enables customers to meet the near-stringent requirements of advanced devices such as trench gates, enhancing their competitiveness in the high-end market.
Toward the 12-inch Era:
Our forward-looking technical collaboration has already yielded results. Our 12-inch grinding equipment has completed customer qualification ahead of the curve, providing reliable equipment support for customers to proactively prepare for large-size technology upgrades and secure future process leadership.
With a Partner's Heart:Journeying Together Toward Industry Excellence
The "Aurora Award" is hailed as an industry barometer, and its recognition fills us with a profound sense of responsibility. This award is not only bestowed upon Siplus Semiconductor but also upon all our partners who have walked this path alongside us.
We firmly believe that the best equipment is not a cold machine, but an extension and embodiment of our customers' process expertise. Moving forward, Siplus Semiconductor will continue to adopt the posture of a "partner," dedicating ourselves to the core aspects of semiconductor manufacturing. Through more precise equipment and deeper process understanding, we will help customers solve increasingly advanced manufacturing challenges, jointly driving solid progress in the third-generation semiconductor industry.